| Production Capabilities Single-sided, Double-sided, Multilayers | ||
 |
Layer Count: | 1-24 Layers |
| Material: | FR-1, FR-2, FR-4, FR-5, CEM1, CEM2, High CTI-600, High Tg-200,Teflon, Polyimide, Rodgers, Getek, Flex, and Rigid-Flex. | |
| Min Plated Thru Holes: | 0.009" (0.354 mm) | |
| PTH Tolerance: | +/- 0.003" (0.076 mm) | |
| Finished Cu Thickness: | UL rated up to 9 ounce finish copper | |
| Routing Tolerance: | +/- 0.005" (0.0196 mm) |
|
| Min Trace/Space: | 0.004"/0.004" (0.1/0.1 mm) | |
| Thickness: | 008 for D/S, .016 for 4Layer, .032 for 8 layer | |
| Finish: | HASL, ENIG, Immersion Silver, ImmersionTin, Hard Gold, Nickel | |
| Options: | Gold Tabs, Selective Au, Carbon Ink, Peelable Mask, Micro Via, Controlled Impedance, Score, Punch & Return, Blind Vias and Buried Vias | |
| Certification | ISO 9000 and TS 16949 | |
 |
 |
 |
 |
 |
| Circuit Board Design & Layout |
Quick Turn Prototypes | Production Capabilities Single/Double-sided, & Multilayers |
Quote Request | Component Assembly, Electro-mechanical, & Cables |