FABRICATION CAPABILITIES PLANT ONE PLANT TWO PLANT THREE PLANT FOUR PLANT FIVE PLANT SIX

NICHE CAPABILITY

 S/SIDED D/SIDED
4 LAYER 		6-16 LAYER 4-20 LAYER S/SIDED D/SIDED
4-6 LAYER		 4-12 LAYER D/SIDED
4-6 LAYER

Current Lead Time

 Next day to 3 weeks 4 weeks 3 days -
4 weeks		 5-6 weeks 3 days -
4 weeks		 1 1/2 weeks -
4 weeks

18" x 24" Panel Size

 NO YES YES YES YES YES

21" x 24" Panel Size

 NO NO YES YES YES NO

24" x 28" Panel Size

 NO NO YES NO YES NO

Other Panel Sizes

 12x18, 12x16, 10.5x16, 9x16, 12x12, 14x12 12X18, 14X18, 16X18 NO 12 x 18 12 x 18 12 X 18

Panel Boarder Required

 0.5 .700 COMMERCIAL 0.7 0.7 0.7 0.5

Minimum Line Width (Internal)

 0.007 0.003 0.004 0.004 0.006 0.004

Minimum Line Spacing (Internal)

 0.007 0.003 0.004 0.004 0.006 0.004

Minimum Line Width (External)

 0.007 0.004 0.004 0.004 0.006 0.004

Minimum Line Spacing (External)

 0.007 0.004 0.004 0.004 0.006 0.004

Direct Imaging

 NO NO NO NO NO NO

Minimum Via Size

 0.01 0.008 0.009 0.01 0.01 0.012

Microvias

 NO YES YES NO NO NO

Buried Vias

 NO YES YES NO YES NO

Blind Vias

 NO YES YES NO YES NO

Maximum Aspect Ratio

 NONE 10:01   ?   NO

Controlled Impedance/tolerance

 NO YES +/- 10% YES ? YES NO

Buried Capacitance

 NO IN PROCESS NO NO NO NO

Buried Resistance

 NO IN PROCESS NO NO NO NO

Maximum Layer Count

 6 24 20 8 20 6

Minimum Thickness

 0.031 .0025 core .008 for D/S .016 for 4L .032 for 8L 0.016 0.031 0.006

Maximum Thickness

 0.125 0.25 0.25 0.125 0.125 0.093

Selective Soft Gold (MCM)

 NO YES YES NO YES YES

Selective Hard Gold (SIMM)

 NO YES YES NO YES YES

Immersion Gold (Ni/Au Flash)

 NO YES YES YES YES YES

HASL

 YES YES YES YES YES YES

Fused Sn/Pb

 NO YES NO NO NO NO

Getek

 YES YES YES YES YES NO

OSP
(Entek CU106A)

 NO YES YES YES YES YES

Palladium-Nickel

 NO NO NO YES NO YES

Immersion Tin

 NO YES YES YES YES NO

Selective Solder Deposition

 NO YES NO